AN-V-150

Copper in nickel plating bath

Summary

The concentration of Cu in a Ni plating bath is determined by polarography in chloride-containing acetate buffer at pH 4.7.

Download AN-V-150 (EN)

Kontakt

Metrohm Nordic ApS

Lyskær 3C. 1. th.
2730 Herlev

Kontakt

Find applikationer

Præcisér din søgning(43)

Denne applikation er tagget under

// Plating baths – nickel

Lead stabilizer in an electroless Ni plating bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

Bismuth stabilizer in an electroless Ni plating bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

Antimony stabilizer in an electroless Ni bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

Monitoring complexing agents in galvanic baths inline with Raman spectroscopy

// Plating baths – nickel // Energy // Spectroscopy (NIRS-Raman)

2 / 4